Wolfspeed Email Format

Semiconductor Manufacturing
1,001-2,500 employees
Durham, NC, USA

Wolfspeed is a semiconductor manufacturing company that leads the global adoption of silicon carbide technologies for power devices and modules across automotive, industrial, and energy applications.

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first.last@wolfspeed.com

Company Overview

Industry
Semiconductor Manufacturing
Founded
2015
Headquarters
Durham, NC, USA
Revenue
$500M-$1B
FUNDING Stage
Public
Key Executives
Robert Feurle (Chief Executive Officer), Gregor van Issum (Chief Financial Officer and Executive Vice President), David Emerson (Executive Vice President and Chief Operating Officer)

Tech Stack

Snowflake

Analytics

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Key Executives

Chief Executive Officer

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Chief Finance Officer

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Chief Operating Officer

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Chief Technology Officer

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Chief Marketing Officer

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Chairman

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4.9/5 on G2
40K+ GTM professionals
SOC 2 Type II certified

Frequently Asked Questions

What is the email format of Wolfspeed?

Wolfspeed uses the first.last format, so Jane Smith would be jane.smith@wolfspeed.com.

What markets does Wolfspeed serve with its silicon carbide power devices?

Wolfspeed supplies silicon carbide power devices for electric vehicle powertrains, industrial power conversion, and energy infrastructure, with automotive partners including Mercedes-Benz, General Motors, and Toyota confirmed as customers.

Who is the Chief Technology Officer of Wolfspeed in 2026?

Elif Balkas, Ph.D., serves as Chief Technology Officer at Wolfspeed in 2026. She has been a central figure in the company's 300mm silicon carbide wafer breakthrough announced in January 2026.

How can I find and verify a Wolfspeed contact's email address for outreach?

Since Wolfspeed uses the first.last@wolfspeed.com format, you can build an address from any employee's name. Tools like Clay can help you verify those addresses and enrich your prospect list with role and team data before reaching out.

Where does Wolfspeed stand on 300mm silicon carbide wafer production in 2026?

In January 2026, Wolfspeed successfully produced its first single-crystal 300mm silicon carbide wafer, a milestone the company is now leveraging to pursue next-generation AI and high-performance computing packaging applications.

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